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 (R)
STPS20L15D/G
LOW DROP OR-ing POWER SCHOTTKY DIODE
MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS
n
20 A 15 V 125C 0.33 V
K
K
n
n
VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK SIZE REVERSE VOLTAGE SUITED TO OR-ing OF 3V, 5V and 12V RAILS AVALANCHE CAPABILITY SPECIFIED TO-220AC STPS20L15D
A
A K
NC
DESCRIPTION Packaged in TO-220AC or D2PAK, this device is especially intended for use as an OR-ing diode in fault tolerant power supply equipments. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt *: RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 115C = 1 tp = 10 ms Sinusoidal tp = 2 s F = 1kHz tp = 100 s tp = 1s Tj = 25C Parameter Repetitive peak reverse voltage
D2PAK STPS20L15G
Value 15 30 20 310 2 3 13500 - 65 to + 150 125 10000
Unit V A A A A A W C C V/s
dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a )
THERMAL RESISTANCES Symbol Rth (j-c) Junction to case Parameter Value 1.6 Unit C/W
July 2003 - Ed: 3B
1/5
STPS20L15D/G
STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF * Tests Conditions Reverse leakage current Forward voltage drop Tests Conditions Tj = 25C Tj = 100C Tj = 25C Tj = 25C Tj = 125C Tj = 125C
Pulse test : * tp = 380 s, < 2%
Min.
Typ. 200
Max. 6 500 0.41 0.52
Unit mA V
VR = 15V VR = 15V IF = 19 A IF = 40 A IF = 19 A IF = 40 A 0.28 0.42
0.33 0.50
To evaluate the maximum conduction losses use the following equation : P = 0.18 x IF(AV) + 8.10-3 x IF2(RMS) Fig. 1: Average forward power dissipation versus Fig. 2: Average forward current versus ambient average forward current. temperature ( = 1).
8 7 6 5 4 3 2 1 0 IF(av) (A) 0 2 4 6 8 10 12 14 16
=tp/T
T
PF(av)(W)
= 0.1 = 0.05 = 0.2 = 0.5 =1
tp
18
20
22
22 20 18 16 14 12 10 8 6 4 2 0
IF(av)(A)
Rth(j-a)=Rth(j -c) Rth(j-a)=15C/W
Rth(j-a)=35C/W
T
=tp/T
tp
Tamb(C) 50 75 100 125
0
25
Fig. 3: Normalized avalanche power derating versus pulse duration.
PARM(tp) PARM(1s)
1
Fig. 4: Normalized avalanche power derating versus junction temperature.
1.2 1
PARM(tp) PARM(25C)
0.1
0.8 0.6
0.01
0.4 0.2
0.001
0.01 0.1 1
tp(s)
10 100 1000
Tj(C)
0 0 25 50 75 100 125 150
Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values).
IM(A) 250 200 150 100 50 0 1E-3
IM t
Tc=50C
Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration.
Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4
= 0.5
= 0.2 = 0.1
Tc=75C
T
0.2
=0.5
t(s) 1E-2 1E-1
Tc=110C
tp (s)
Single pulse
=tp/T
tp
1E+0
0.0 1.0E-4
1.0E-3
1.0E-2
1.0E-1
1.0E+0
2/5
STPS20L15D/G
Fig. 7: Reverse leakage current versus reverse voltage applied (typical values).
5E+2 1E+2 IR(mA)
5.0
Tj=100C
Fig. 8: Junction capacitance versus reverse voltage applied (typical values).
C(nF)
F=1MHz Tj=25C
1E+1
1.0
1E+0
Tj=25C
1E-1
VR(V) 0 2 4 6 8 10 12 14 16
VR(V) 0.1 1 2 5 10 20
Fig. 9: Forward voltage drop versus forward current (typical values).
IFM(A)
200.0 100.0
Tj=125C
Fig. 10: Forward voltage drop versus forward current (maximum values).
200 100 IFM(A)
Tj=100C
10.0
Tj=75C
10
1.0
Tj=25C
VFM(V)
0.1
1
1 1.2 1.4 1.6
VFM(V) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
0
0.2
0.4
0.6
0.8
Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 m). (STPS20L15G only)
Rth(j-a) (C/W) 80 70 60 50 40 30 20 10 0 0 4 8 12 S(Cu) (cm) 16 20 24 28 32 36 40
3/5
STPS20L15D/G
PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF.
A E L2 C2
Millimeters Min. Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0 8
Inches Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0 8
D L L3 A1 B2 B G A2 C R
M
*
V2
A A1 A2 B B2 C C2 D E G L L2 L3 M R V2
* FLAT ZONE NO LESS THAN 2mm
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30 1.30
5.08
3.70 8.90
4/5
STPS20L15D/G
PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF.
H2 C L5 OI L6 L2 D L7 A
Millimeters Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 4.95 5.15 10.00 10.40 16.40 typ. 13.00 14.00 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85
Inches Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.194 0.202 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151
L9 F1 L4
F G
M E
A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I
Ordering type STPS20L15D STPS20L15G STPS20L15G-TR
n n n n
Marking STPS20L15D STPS20L15G STPS20L15G
Package TO-220AC D PAK D PAK
2 2
Weight 1.86 g. 1.48g. 1.48 g.
Base qty 50 50 1000
Delivery mode Tube Tube Tape and reel
Cooling method: by conduction (C) Recommended torque value: 0.55 m.N Maximum torque value: 0.7 m.N Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5


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